貝格斯 Gap Filler 1400SL，Gap Filler 1400SL

貝格斯 Gap Filler 1400SL

特點(diǎn)和好處

導(dǎo)熱系數(shù)：  1.8W

硬度:(Shore00) 40

阻燃等級(jí)：  V-O

連續(xù)使用溫度： -60℃+200℃

介電強(qiáng)度：(V/mil) 2500V

自動(dòng)流平

非常柔軟

振動(dòng)阻尼

Gap Filler 1400SL液體空隙填充材料擁有熱傳導(dǎo)和硅基材料特點(diǎn)。這種材料擁有非常低的粘度，從而使得其會(huì)自動(dòng)流平和自動(dòng)填充空隙，導(dǎo)致熱傳導(dǎo)更佳。液體材料能夠滿足各種不同的間隙形狀厚度，而且在位移時(shí)應(yīng)力極小，可以解決個(gè)別應(yīng)用中對(duì)界面材料厚度和形狀的需求。Gap Filler 1400SL間隙填充導(dǎo)熱材料應(yīng)用于不需要牢固粘接結(jié)構(gòu)的熱傳導(dǎo)界面。

典型的應(yīng)用包括：汽車電子.電信.封裝半導(dǎo)體和磁性元件與散熱片.有機(jī)硅敏感應(yīng)用.照明.電力供應(yīng)

性能：

配置可用

• 可在1200包秩序和7加侖桶的格式

 

 

Typical Properties of Gap Filler 1400SL
Property	Imperial Value	Metric Value	Test Method
Color / Part A	Yellow	Yellow	Visual
Color / Part B	White	White	Visual
Viscosity, As Mixed (cps) (1)	5000	5000	ASTM D2196
Density (g/cc)	2.5	2.5	ASTM D792
Mix Ratio	1:1	1:1	***
Shelf Life @ 25oC (months)	6	6	***
Property As Cured
Color	Yellow	Yellow	Visual
Hardness (Shore 00) (3)	40	40	ASTM D2240
Heat Capacity (J/g-K)	0.9	0.9	ASTM D1269
Siloxane Content (ppm)	40	40	***
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	***
Electrical As Cured
Dielectric Strength (V/mil)	250	250	ASTM D149
Dielectric Constant (1000 Hz)	6.0	6.0	ASTM D150
Volume Resistivity (Ohm-meter)	1011	1011	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
Thermal As Cured
Thermal Conductivity (W/m-K)	1.4	1.4	ASTM D5470
CURE SCHEDULE
Working Time @ 25oC (min) (4)	120 min	120 min	***
Cure @ 25oC (hrs) (4)	24	24	***
Cure @ 100oC (min) (4)	30	30	***
1) Brookfield Rheometer, Part A and Part B mixed 1:1 ratio. 2) See application note for storage and handling recommendations. 3) Thirty second delay value, Shore 00 scale. 4) Parallel Plate Rheometer, see reactivity application note.